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內容簡介
FEATURES
? Low profile package
? Ideal for automated placement
? Glass passivated chip junction
? Available in uni-directional and bi-directional
? Excellent clamping capability
? Very fast response time
? Low incremental surge resistance
? Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
? Solder dip 260 °C, 40 s
? Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
下載說明
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