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內(nèi)容簡(jiǎn)介
FEATURES
? Low profile package
? Ideal for automated placement
? Glass passivated chip junction
? Ultrafast recovery times for high efficiency
? Low forward voltage, low power losses
? High forward surge capability
? Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
? Solder dip 260 °C, 40 s
? Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in high frequency rectification and
freewheeling application in switching mode converters
and inverters for consumer, computer, automotive and
telecommunication.
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