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內(nèi)容簡介
FEATURES
?Superectifier structure for high reliability
application
?Cavity-free glass-passivated junction
?Low forward voltage drop
?Low leakage current, typical IR less than
0.1 μA
?High forward surge capability
?Meets environmental standard MIL-S-19500
?Solder dip 260 °C, 40 s
?Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
下載說明
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